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Patent Searching and Data


Title:
PROBE GUIDE PLATE, PROBE DEVICE, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2017129367
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a probe guide plate of new construction in which two guide plates are stacked one on top of another with high reliability at low cost.SOLUTION: The probe guide plate includes: a first silicon substrate 11; a first recess C1 formed in the top face of the first silicon substrate 11; a first through-hole TH1 formed on the first silicon substrate 11 at the bottom of the first recess C1; a second silicon substrate 12 directly joined to the top of the first silicon substrate 11; a second recess C2 formed in the underside of the second silicone substrate 12 facing the first recess C1; and a second through-hole TH2 formed in the second silicon substrate 12 at the bottom of the second recess C2 and arranged in correspondence to the first through-hole TH1. A notch part N is formed at the inner wall upper end of the first through-hole TH1 of the first silicon substrate 11.SELECTED DRAWING: Figure 11

Inventors:
SHIMIZU YUICHIRO
FUJIWARA KOSUKE
YAMAGISHI KATSUNORI
NAGAI KOJI
Application Number:
JP2016006980A
Publication Date:
July 27, 2017
Filing Date:
January 18, 2016
Export Citation:
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Assignee:
SHINKO ELECTRIC IND CO
JAPAN ELECTRONIC MATERIALS
International Classes:
G01R1/06; G01R1/073; H01L21/66
Domestic Patent References:
JP2011203280A2011-10-13
JPH0758169A1995-03-03
JP2014181910A2014-09-29
JP2003215160A2003-07-30
JP2004325305A2004-11-18
Foreign References:
US7546670B22009-06-16
Attorney, Agent or Firm:
Keizo Okamoto