Title:
LASER PROCESSING DEVICE AND METHOD OF PROCESSING WAFER
Document Type and Number:
Japanese Patent JP2016107330
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser processing device and a method of processing a wafer capable of forming a modified layer along a division scheduled line inside the wafer without damaging a device even when a light convergence point of a laser beam is positioned inside from a surface side of the wafer and the laser beam is irradiated along the division scheduled line.SOLUTION: Laser beam irradiation means 52 comprises: laser beam oscillation means 53 for oscillating a laser beam; a light condenser 54 for condensing the laser beam oscillated from the laser beam oscillation means to be irradiated on a workpiece w held on a holding surface of workpiece holding means 36; and a spot adjustment means 56 for adjusting a spot of the laser beam to be irradiated on the workpiece arranged between the laser beam oscillation means and the light condenser, and held by the workpiece holding means to be the one with appropriate size on an irradiated surface of the workpiece.SELECTED DRAWING: Figure 2
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Inventors:
FURUTA KENJI
YUHIRA YASUKICHI
YUHIRA YASUKICHI
Application Number:
JP2014250133A
Publication Date:
June 20, 2016
Filing Date:
December 10, 2014
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23K26/073; B23K26/03; B23K26/064; B23K26/53; H01L21/301
Domestic Patent References:
| JP2005014050A | 2005-01-20 | |||
| JP2007275912A | 2007-10-25 | |||
| JP2000288753A | 2000-10-17 | |||
| JP2003338468A | 2003-11-28 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sayaka Hirakawa
Toshiyuki Kojima
Sachiko Okunuki
Sayaka Hirakawa
Toshiyuki Kojima