Title:
PROCESSING METHOD, PROCESSING SYSTEM, AND PROCESSING PROGRAM
Document Type and Number:
Japanese Patent JP2018069307
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a processing method capable of shortening a processing time and obtaining an objective in a high process tolerance.SOLUTION: A processing method for processing a material by using a laser comprises: a first processing step of forming a target in a material by irradiation with the laser; and a second processing step of forming a disconnection part in the material by irradiating a place outer than a position at which the target is formed with the laser.SELECTED DRAWING: Figure 3E
Inventors:
MAEDA TOSHIO
Application Number:
JP2016214176A
Publication Date:
May 10, 2018
Filing Date:
November 01, 2016
Export Citation:
Assignee:
ROLAND DG CORP
International Classes:
B23K26/53; B23K26/04; B23K26/073; C04B41/91
Domestic Patent References:
| JP2016513016A | 2016-05-12 | |||
| JPS61159293A | 1986-07-18 | |||
| JP2001096995A | 2001-04-10 | |||
| JP2001150879A | 2001-06-05 |
Foreign References:
| US20160016257A1 | 2016-01-21 |
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation
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