Title:
PROTECTION METHOD OF SURFACE OF METALLIC SUBSTRATE OR METAL INCLUSION ELECTRODE SUBSTRATE
Document Type and Number:
Japanese Patent JP2017002380
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a novel method which avoids and reduces metal erosion, while maintaining heat resistance and electric insulation in a metal electrode, without spoiling decorativeness of the metal substrate.SOLUTION: A negative charge material is arranged in a surface or a surface layer of the metal substrate or the metal inclusion electrode substrate, and a surface of the metal substrate or the metal inclusion electrode substrate is protected by charging the surface of the substrate. The negative charge material is at least one of a negative charge material selected from a group of (1) a negative ion, (2) any of composite bodies of a composite body of conductive body and a dielectric body with negative charge, a composite body of a conductive body and a semiconductor with negative charge, and a composite body comprising two or more kinds of dielectric or/and a semiconductor, (3) a material with a photocatalytic function.SELECTED DRAWING: Figure 1
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Inventors:
OGATA SHIRO
MATSUI YOSHIMITSU
MATSUI YOSHIMITSU
Application Number:
JP2015119783A
Publication Date:
January 05, 2017
Filing Date:
June 12, 2015
Export Citation:
Assignee:
SUSTAINABLE TITANIA TECH INC
International Classes:
C23C26/00; B32B15/04
Domestic Patent References:
| JP2014031470A | 2014-02-20 | |||
| JP2002348540A | 2002-12-04 | |||
| JP2014031470A | 2014-02-20 | |||
| JP2002348540A | 2002-12-04 |
Attorney, Agent or Firm:
Akiko Sato
Keiko Shiotani
Keiko Shiotani