Radiation-sensitive resin composition and resist pattern forming method

Title:

Radiation-sensitive resin composition and resist pattern forming method

Document Type and Number:

Japanese Patent JP6323460

Kind Code:

B2

Abstract:

A radiation-sensitive resin composition comprises: a polymer, and a radiation-sensitive acid generator. The polymer comprises a structural unit comprising: an acid-labile group; and an oxoacid group or phenolic hydroxyl group protected by the acid-labile group. The acid-labile group is represented by formula (1). R1 and R2 each independently represent a divalent organic group having 1 to 20 carbon atoms. R3 represents a monovalent group having 1 to 40 atoms and having at least one selected from the group consisting of an oxygen atom, a sulfur atom and a nitrogen atom. * denotes a binding site to the oxy group in the oxoacid group or phenolic hydroxyl group protected.

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Inventors:

Ikui Junto

Application Number:

JP2015539153A

Publication Date:

May 16, 2018

Filing Date:

September 18, 2014

Export Citation:

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Assignee:

JSR CORPORATION

International Classes:

G03F7/039; G03F7/038

Domestic Patent References:

JP2008203535A
JP2004086020A
JP2012173505A
JP2002156762A
JP2002156761A
JP2000214587A

Foreign References:

WO2011040175A1
WO2010095698A1

Attorney, Agent or Firm:

Hajime Amano

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