Title:
RESIN COMPOSITION, AND RESIN MOLDED BODY
Document Type and Number:
Japanese Patent JP2018053091
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a resin molded body excellent in bending elastic modulus.SOLUTION: A resin composition contains polyolefin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond, where a content with respect to 100 pts.mass of the polyolefin is more than 20 pts.mass and 100 pts.mass or less, and a compatibilizer, where a part of the resin containing at least one of the amide bond and the imide bond forms a domain with a diameter of 0.1 μm or more and 10 μm or less in the polyolefin.SELECTED DRAWING: None
Inventors:
MORIYA HIROYUKI
OGOSHI MASAYUKI
MIYAMOTO TAKESHI
OGOSHI MASAYUKI
MIYAMOTO TAKESHI
Application Number:
JP2016190271A
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
Assignee:
FUJI XEROX CO LTD
International Classes:
C08L23/00; C08K7/06
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office