The resin composition for ultraviolet curing type adhesives, and an adhesive

Title:

The resin composition for ultraviolet curing type adhesives, and an adhesive

Document Type and Number:

Japanese Patent JP5994424

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide an ultraviolet-curable resin composition for adhesive, which has excellent adhesive power at a level not causing delamination with time to backing materials made of various materials and excellent step difference followability.SOLUTION: An ultraviolet-curable resin composition for adhesive contains an urethane (meth)acrylate resin (A) obtained by reacting a polyol (a), a polyisocyanate (b) and (meth)acrylate compound having a hydroxyl group (c), (meta)acrylic monomer (B), and a photoinitiator (C). The equivalent of the (meth)acryloyl group in the urethane (meth)acrylate resin (A) is in a range of 8,000-17,000.

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Inventors:

Keiji Tsunashima
Mariko Konishi
Fujii Yuri
Kojiro Tanaka

Application Number:

JP2012141950A

Publication Date:

September 21, 2016

Filing Date:

June 25, 2012

Export Citation:

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Assignee:

DIC Corporation

International Classes:

C09J175/14; C08F290/06; C09J4/02; C09J7/00; C09J11/06

Domestic Patent References:

JP2011093957A
JP2011116940A
JP2012111852A
JP2011021173A
JP2007254705A
JP2015193693A
JP2012079927A
JP2005530025A
JP2009177025A

Foreign References:

WO2012077727A1

Attorney, Agent or Firm:

Kono Tsuyo

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