Title:
A semiconductor device, Dia touch material, and a manufacturing method of a semiconductor device
Document Type and Number:
Japanese Patent JP6247204
Kind Code:
B2
Abstract:
Provided is a semiconductor device (10) comprising: a substrate (1); an adhesive layer (2); and a light emitting diode chip (3), in which the adhesive layer (2) is a cured product of a die attach material, and the die attach material contains at least one resin component (A) selected from the group consisting of a compound (A1) represented by the following formula (1) and an acrylate compound (A2) which has a cycloalkylene group and two or more (meth) acrylic groups and does not have an aromatic ring in one molecule, a silane coupling agent (B), and an inorganic filler (C).
(wherein X represents an oxygen atom or a nitrogen atom; m and n each independently represent 0 or 1; R 1 , R 2 , R 3 , and R 4 each independently represent a hydrogen atom or an organic group not having an aromatic ring; at least two of R 1 , R 2 , R 3 , and R 4 each independently represent an organic group having a (meth)acrylic group.)
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Inventors:
Koji Makihara
Raw daffodils
Man Lin Sam
Raw daffodils
Man Lin Sam
Application Number:
JP2014510055A
Publication Date:
December 13, 2017
Filing Date:
April 10, 2013
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
Sumitomo Bakelite Singapore Private Limited
Sumitomo Bakelite Singapore Private Limited
International Classes:
H01L33/48; C09J4/02; C09J11/04; C09J11/06; H01L21/52
Domestic Patent References:
| JP2004266134A | ||||
| JP2001019821A | ||||
| JP2010285602A | ||||
| JP2010106244A | ||||
| JP2002363218A | ||||
| JP2008101093A | ||||
| JP2000265119A | ||||
| JP9291259A | ||||
| JP2011063664A | ||||
| JP2011079893A |
Foreign References:
| WO2011145524A1 |
Attorney, Agent or Firm:
Shinji Hayami
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