Title:
SEMICONDUCTOR DEVICE AND OPTICAL COUPLING DEVICE
Document Type and Number:
Japanese Patent JP2017050510
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a second semiconductor element bonded to a first semiconductor element does not peel off.SOLUTION: An optical coupling device 1, which is a semiconductor device, includes: a light-receiving chip 6, which is a first semiconductor element; a light-emitting chip 7 provided on the first semiconductor element, which is a second semiconductor element; a gelatinous silicone, which is a first resin part 10, covering a surface of the second semiconductor element; and a second resin part 11 covering a surface of the silicone and a surface of the first semiconductor element. The gelatinous silicone is soft and functions as a stress relaxation material.SELECTED DRAWING: Figure 1B
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Inventors:
TAKAI NAOYA
Application Number:
JP2015175055A
Publication Date:
March 09, 2017
Filing Date:
September 04, 2015
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L31/12; H01L23/29; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2012169511A | 2012-09-06 | |||
| JP2004144705A | 2004-05-20 | |||
| JP2010174250A | 2010-08-12 | |||
| JP2006093738A | 2006-04-06 | |||
| JP2003234500A | 2003-08-22 | |||
| JP2015029037A | 2015-02-12 | |||
| JPH07307469A | 1995-11-21 | |||
| JPS5869965U | 1983-05-12 | |||
| JP2002141549A | 2002-05-17 |
Foreign References:
| US20140117383A1 | 2014-05-01 |
Attorney, Agent or Firm:
Takeshi Sekine
Hirohito Katsunuma
Akaoka Akira
Yasushi Kawasaki
Hirohito Katsunuma
Akaoka Akira
Yasushi Kawasaki