Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023037354
Kind Code:
A
Abstract:
To provide a semiconductor device with suppressed thermal stress applied to one surface of an encapsulation body.SOLUTION: A semiconductor device comprises: a first semiconductor element 30L and a second semiconductor element 30H arranged in one direction; a first intermediate conductor part 41L connected with the first semiconductor element, having an output terminal 73; a first power supply conductor part 51L connected with the first semiconductor element on a surface opposite to the first intermediate conductor part, having a first power supply terminal 71; a second intermediate conductor part 51H connected with the second semiconductor element and arranged side by side with the first power supply conductor part in the one direction and a lengthwise direction; a second power supply conductor part 41H connected with the second semiconductor element on a surface opposite to the second intermediate conductor part, having a second power supply terminal 72 and having a heat capacity larger than that of the first power supply conductor part; a joint part; and an encapsulation body 20 sealing them. The output terminal, the first power supply terminal, and the second power supply terminal are protruded from one surface 20c of the encapsulation body. The protruded portions from the encapsulation body are arranged in an order of the output terminal, the second power supply terminal, and the first power supply terminal in the one direction.SELECTED DRAWING: Figure 3
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Inventors:
KATO CHIHIRO
NISHIHATA MASAYOSHI
KATO YASUSHI
KAWANO MITSUKI
NISHIHATA MASAYOSHI
KATO YASUSHI
KAWANO MITSUKI
Application Number:
JP2021144042A
Publication Date:
March 15, 2023
Filing Date:
September 03, 2021
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L25/07; H01L23/29; H01L29/12; H01L29/739; H01L29/78
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo