Title:
センサ
Document Type and Number:
Japanese Patent JP7116923
Kind Code:
B2
Abstract:
In a sensor for which a metal lid is adhered to a metal case, it is possible to improve heat dissipation. This sensor 1 comprises: a metal case 10 that houses a circuit board 40 electrically connected to a sensor element, and for which are provided an opening 15 and an edge part 11 that defines the opening 15; and a metal lid 20 that is adhered to the edge part 11 so as to cover the opening 15. One or more recesses 14 are provided on at least one of the edge part 11 and the metal lid 20, and the metal lid 20 is adhered to the edge part 11 by the portion of an adhesive agent 50 filled inside the recess 14 that is positioned at the area of the open end of the recess 14.
Inventors:
Hidenori Ohara
Miyata Tsuyoshi
Miyata Tsuyoshi
Application Number:
JP2019038686A
Publication Date:
August 12, 2022
Filing Date:
March 04, 2019
Export Citation:
Assignee:
OMRON Corporation
International Classes:
H01H9/02; H01H35/00; H01L31/12; H05K5/00; H05K5/04; H05K5/06
Domestic Patent References:
| JP55097989U | ||||
| JP4159799A | ||||
| JP2006524910A | ||||
| JP2010272561A | ||||
| JP2018152227A | ||||
| JP2017157487A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toyotaka Abe
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toyotaka Abe