Title:
銀ペースト
Document Type and Number:
Japanese Patent JP7461191
Kind Code:
B2
Abstract:
To provide a technology that, by using a silver paste, improves easy formability of a conductive film and the heat resistance of the conductive film.SOLUTION: According to the technique disclosed herein, silver paste is provided which includes silver particles, resin components and organic solvents. The silver particles contain fist silver particles which have a tap density of smaller than 3 g/cm3, a specific surface area of 1 m2/g or larger, and an average particle size of 3 μm or larger. In the silver particles, the content of the first silver particles is 5% or larger and 60% or smaller. The resin component includes a polyimide resin having Td5 of 300°C or higher, and a weight average molecular weight of not smaller than 30000. In the resin component, the content rate of the polyimide resin is 50 mass% or larger and 100 mass% or smaller. Here, when the silver particle is set to 100 pts.mass, the resin component is contained in a proportion of 5 pts.mass or larger and 20 pts.mass or smaller.SELECTED DRAWING: Figure 2
Inventors:
Yuko Suzuki
Western Kaho
Western Kaho
Application Number:
JP2020057147A
Publication Date:
April 03, 2024
Filing Date:
March 27, 2020
Export Citation:
Assignee:
Noritake Company Limited
International Classes:
B22F1/00; C08K3/105; C08L79/08; C08L83/04; H01C1/142; H01G4/30
Domestic Patent References:
| JP2014145011A | ||||
| JP2007217490A | ||||
| JP6279680A | ||||
| JP4855077B2 |
Attorney, Agent or Firm:
Makoto Abe