Title:
はんだ付け部品
Document Type and Number:
Japanese Patent JP7144245
Kind Code:
B2
Abstract:
A solder component includes one or more terminal members each having a bending portion bending in a direction crossing a surface of a substrate and being connected to the surface of the substrate, and four or more substrate connection portions formed at end portions of the terminal members, three substrate connection portions out of the four or more substrate connection portions each having a width narrower than a width of the bending portion of the corresponding terminal member, when the solder component is disposed on the surface of the substrate, only the three substrate connection portions being in contact with the surface of the substrate, and no matter where a contact point contacting the surface of the substrate is provided on each substrate connection portion, a mass center of the solder component being located inside a triangle determined by three contact points of the three substrate connection portions.
Inventors:
Tohashi Hashiguchi
Application Number:
JP2018162863A
Publication Date:
September 29, 2022
Filing Date:
August 31, 2018
Export Citation:
Assignee:
Japan Aviation Electronics Industry Co., Ltd.
International Classes:
H05K1/18; H01L23/50; H01R4/02; H01R12/57
Domestic Patent References:
| JP6241752A | ||||
| JP60039252U | ||||
| JP2031148U | ||||
| JP63137954U | ||||
| JP2002323308A | ||||
| JP2013254797A | ||||
| JP2014239196A |
Attorney, Agent or Firm:
Hideaki Ito