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Title:
SUBSTRATE ATTACHING/DETACHING DEVICE, PLATING DEVICE, CONTROLLER FOR SUBSTRATE ATTACHING/DETACHING DEVICE, AND RECORDING MEDIUM THAT STORES PROGRAM FOR MAKING COMPUTER CARRY OUT METHOD OF CONTROLLING SUBSTRATE ATTACHING/DETACHING DEVICE
Document Type and Number:
Japanese Patent JP2018104735
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate attaching/detaching device capable of improving attachment/detachment of a substrate to and from a substrate holder.SOLUTION: The substrate attaching/detaching device for holding a substrate between a first and a second holding members of a substrate holder, comprises a first holder-holding device that supports the first holding member in a first attitude, and a second holder-holding device that can move straight in a manner of getting closer to or getting away from the first holder-holding device, can hold the second holding member in the first attitude or in a second attitude roughly orthogonal to the first attitude, and pushes the second holding member in the first attitude against the first holding member to firmly fix the first holding member and the second holding member together.SELECTED DRAWING: Figure 22A

Inventors:
YOKOYAMA TOSHIO
MUKOYAMA YOSHITAKA
TSUSHIMA TAKUYA
Application Number:
JP2016249631A
Publication Date:
July 05, 2018
Filing Date:
December 22, 2016
Export Citation:
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Assignee:
EBARA CORP
International Classes:
C25D17/06
Domestic Patent References:
JPH03247798A1991-11-05
JP2012107311A2012-06-07
JP2014169475A2014-09-18
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Tatsumi Ono
Makoto Watanabe