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Title:
A substrate treating method and a substrate treatment system
Document Type and Number:
Japanese Patent JP6139634
Kind Code:
B2
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Inventors:
Konosuke Hayashi
Emi Matsui
Nakano Haruka
Application Number:
JP2015216054A
Publication Date:
May 31, 2017
Filing Date:
November 02, 2015
Export Citation:
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Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
H01L21/308; H01L21/306
Domestic Patent References:
JP11026425A
JP2000331982A
JP5102122A
JP2004140368A



 
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