Title:
基板
Document Type and Number:
Japanese Patent JP7425130
Kind Code:
B2
Abstract:
A first substrate includes a first main surface, being made of an insulator, and includes a mounting portion in a rectangular shape for an electronic element, the mounting portion being located on the first main surface, and having one end portion of the mounting portion in a longitudinal direction located at an outer edge portion of the first main surface. A second substrate is located on a second main surface opposite to the first main surface, and includes a third main surface facing the second main surface and a fourth main surface opposite to the third main surface. A third substrate is embedded in the second substrate, is made of a carbon material, and includes a fifth main surface located adjacent to the third main surface in a thickness direction and a sixth main surface opposite to the fifth main. The third substrate has a larger heat conduction in a direction perpendicular to the longitudinal direction of the mounting portion than heat conduction in the longitudinal direction of the mounting portion, in plan view.
More Like This:
| WO/2017/007736 | BALLASTED MOUNT FOR PV PANELS |
| JP3838907 | SEMICONDUCTOR DEVICE |
Inventors:
Yukio Morita
Noboru Kitazumi
Yousuke Moriyama
Noboru Kitazumi
Yousuke Moriyama
Application Number:
JP2022128023A
Publication Date:
January 30, 2024
Filing Date:
August 10, 2022
Export Citation:
Assignee:
Continental Automotive GmbH
International Classes:
H01L23/12; H01L23/36; H05K1/02
Domestic Patent References:
| JP2017130494A | ||||
| JP2012142547A | ||||
| JP2016149450A | ||||
| JP2014038834A | ||||
| JP2011258755A |
Attorney, Agent or Firm:
Keiichiro Saikyo