Title:
温度センサ
Document Type and Number:
Japanese Patent JP7396138
Kind Code:
B2
Abstract:
To provide a temperature sensor capable of improving close contact to an object to be measured and suppressing a variation in temperature measurement.SOLUTION: A temperature sensor comprises: a heat sensitive element part 2; and a crimp terminal 5 including a screw mounting part 3 fixed to an object to be measured by a screw and a bottom surface part 4 contacting the object to be measured having the heat sensitive element part. The bottom surface part curved to be convex on the side of a surface contacting the object to be measured is elastically deformable in the state of contacting the object to be measured; and when attached to the object to be measured thereby, high close contact to the object to be measured is obtained by pressing the curved bottom surface part to elastically deform corresponding to the shape of the object to be measured.SELECTED DRAWING: Figure 1
Inventors:
Toshihiro Yoshida
Hitoshi Inaba
Hitoshi Inaba
Application Number:
JP2020047171A
Publication Date:
December 12, 2023
Filing Date:
March 18, 2020
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
G01K7/22; G01K1/143; H01C7/02; H01C7/04
Domestic Patent References:
| JP2019174135A | ||||
| JP2012194115A | ||||
| JP2010185688A |
Attorney, Agent or Firm:
Hideyuki Sugiura