Title:
【発明の名称】無電解めっきのための活性化触媒液および無電解めっき方法
Document Type and Number:
Japanese Patent JP3111891
Kind Code:
B2
Abstract:
Disclosed is an activating catalytic solution for electroless plating which makes possible carrying out successive processes efficiently, without using organic solvent, involving preparation of activating catalytic solution for forming substrate film, formation of a photo-sensitive film by providing the activating catalytic solution, creation of activating catalyst by exposure of specific areas of the photo-sensitive film to light, development by rinsing unexposed portions of the photo-sensitive film, and immersion of the substrate in an electroless plating bath. The activating catalyst can be created with high sensitivity to light at small energy of radiation. The activating catalytic solution preferably contains zinc oxalate, a copper salt, palladium salt such as palladium chloride, and an alkaline solution such as an ammonia water. The activating catalytic solution is used for forming a photo-sensitive film on a substrate to be subjected to electroless plating.
Inventors:
Osamu Kano
Ikuji Yoshida
Kosei Senda
Ikuji Yoshida
Kosei Senda
Application Number:
JP8672596A
Publication Date:
November 27, 2000
Filing Date:
April 09, 1996
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C04B41/45; C04B41/52; C04B41/81; C04B41/89; C23C18/16; C23C18/30; H05K3/18; (IPC1-7): C23C18/30
Attorney, Agent or Firm:
Masaaki Koshiba (1 outside)