Title:
ULTRASONIC PROBE MANUFACTURING METHOD AND ULTRASONIC PROBE
Document Type and Number:
Japanese Patent JP2017153789
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce manufacturing cost by downsizing a housing and also simplifying an assembly process.SOLUTION: An ultrasonic probe manufacturing method assembles an ultrasonic probe including a probe substrate on a first main surface of which laminated oscillators are mounted and on a second main surface of which sensor electrodes connected to the laminated oscillators are formed, and an interposer substrate where interposer electrodes 141a are formed on the first main surface arranged toward the second main surface of the probe substrate, and an external electrode is formed on the second main surface, and a processing IC is mounted. The method comprises: forming a metal bump on the interposer electrodes of the interposer substrate; supplying conductive paste is supplied onto the metal bump; positioning the sensor electrodes on the second main surface of the probe substrate and the interposer electrodes; and curing the conductive paste.SELECTED DRAWING: Figure 3D
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Inventors:
ASAGIRI SATOSHI
ONO MICHIKO
TOGASAKI TAKASHI
INOUE MICHINOBU
SOGO TAKAHIRO
ONO MICHIKO
TOGASAKI TAKASHI
INOUE MICHINOBU
SOGO TAKAHIRO
Application Number:
JP2016041103A
Publication Date:
September 07, 2017
Filing Date:
March 03, 2016
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
A61B8/14; H04R17/00; H04R31/00
Attorney, Agent or Firm:
Kurata Masatoshi
Nobuhisa Nogawa
Takashi Mine
Naoki Kono
Tadashi Inoue
Ukai Ken
Nobuhisa Nogawa
Takashi Mine
Naoki Kono
Tadashi Inoue
Ukai Ken