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Title:
WIRING CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2017195221
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring circuit board in which electric signal loss is reduced in a high frequency band; and provide a manufacturing method of the wiring circuit board.SOLUTION: A suspension board comprises: a ground layer 50 and a first insulation layer 41 which are formed on a support substrate 10, in which the ground layer 50 has higher electric conductivity than the support substrate 10; a power supply wiring pattern P1 formed on the first insulation layer 41; a second insulation layer 42 formed on the support substrate 10 so as to cover the ground layer 50 and the first insulation layer 41; and wiring patterns W1, W2 for writing formed on the second insulation layer 42 so as to partially overlap the ground layer 50. An interval d1 between the ground layer 50 and the wiring patterns W1, W2 for writing in a lamination direction of the support substrate 10, the first insulation layer 41 and the second insulation layer 42 is set larger than an interval d2 between the power supply wiring pattern P1 and the wiring pattern W1 for writing in the lamination direction.SELECTED DRAWING: Figure 4

Inventors:
YAMAUCHI DAISUKE
TANABE HIROYUKI
Application Number:
JP2016082857A
Publication Date:
October 26, 2017
Filing Date:
April 18, 2016
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
H05K1/05; H05K1/02; H05K3/44
Domestic Patent References:
JP2010003893A2010-01-07
JP2004501511A2004-01-15
JP2012243382A2012-12-10
JP2007164853A2007-06-28
Foreign References:
WO2009147956A12009-12-10
US20090079523A12009-03-26
Attorney, Agent or Firm:
Yoshito Fukushima
Masahiro Nakagawa
Sawamura Hideyuki



 
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