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Patent Searching and Data


Title:
3D SENSING MODULE AND APPLICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/151395
Kind Code:
A1
Abstract:
A 3D sensing module and an application method. The sensing module comprises a support (1) and a connection part; the support (1) is of a cuboid shape and comprises panels (101) and a support rack (102); the panels (101) are fixed to the support rack (102); the six panels (101) are six surfaces of the cube; a gap is formed between adjacent panels (101); sensors (11) are provided on the panels (101); a communication module (12) is mounted in a space defined by the six panels (101); signal output lines of the sensor (11) are connected to the communication module (12); the connection part comprises a concave connection part (22); at least one connection part is disposed on the outer surfaces of the panels (101). In use, 3D modules are piled up to form a full-scale model of a product according to drawing of the product, the sensors (11) of the 3D sensing module are used for sensitively capturing tension and compression data of an internal force, and pressure data in the model is transmitted to an external control center (5) by means of the communication module (12). The application method of the 3D sensing module facilitates optimization of a product structure, and the mold costs and time are greatly reduced.

Inventors:
HE RENCHENG (CN)
Application Number:
PCT/CN2019/125462
Publication Date:
July 30, 2020
Filing Date:
December 15, 2019
Export Citation:
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Assignee:
SHENZHEN DAKEQI TECH CO LTD (CN)
International Classes:
G08C17/02; G01L5/00
Foreign References:
CN109738102A2019-05-10
CN208158954U2018-11-27
CN205721510U2016-11-23
CN206683659U2017-11-28
CN103226038A2013-07-31
CN108860926A2018-11-23
CN208367528U2019-01-11
US20170102606A12017-04-13
Attorney, Agent or Firm:
ZHONGZHI PATENT & TRADEMARK AGENT CO., LTD. (CN)
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