ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE

Title:

ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2015/098197

Kind Code:

A1

Abstract:

An abrasive which comprises a liquid medium, abrasive grains including a hydroxide of a tetravalent metallic element, a first additive, a second additive, and a third additive, wherein the first additive is at least one type selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer, the second additive is a cationic polymer, and the third additive is an amino group-containing sulfonic acid compound.

Inventors:

MINAMI HISATAKA (JP)
IWANO TOMOHIRO (JP)
AKUTSU TOSHIAKI (JP)

Application Number:

PCT/JP2014/073980

Publication Date:

July 02, 2015

Filing Date:

September 10, 2014

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

C09K3/14; B24B37/00; H01L21/304

Domestic Patent References:

WO2009131133A1	2009-10-29
WO2013125441A1	2013-08-29
WO2013125446A1	2013-08-29
WO2014034358A1	2014-03-06

Foreign References:

JP2010141288A	2010-06-24
JP2008091411A	2008-04-17
JP2014207281A	2014-10-30

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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