Title:
ACOUSTIC MATCHING LAYERED MATERIAL, ACOUSTIC MATCHING SHEET, COMPOSITION FOR ACOUSTIC MATCHING LAYERED MATERIAL, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASUREMENT DEVICE, AND METHOD FOR MANUFACTURING ACOUSTIC WAVE PROBE
Document Type and Number:
WIPO Patent Application WO/2023/054204
Kind Code:
A1
Abstract:
Provided are an acoustic matching layered material, an acoustic matching sheet, a composition for the acoustic matching layered material, an acoustic wave probe, an acoustic wave measurement device, and a method for manufacturing the acoustic wave probe, the acoustic matching layered material containing a reaction product resulting from a reaction between an epoxy resin (A) having an epoxy equivalent of 140 or less, and at least one of a monomeric curing agent (B-1) and a curing catalyst (B-2), and metal particles (C) having a density at 20°C of 4.5 g/cm3 to less than 10 g/cm3, and the content of particles (D) having a density at 20°C of less than 4.5 g/cm3 being less than 5 mass%.
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Inventors:
FURUKAWA KAZUSHI (JP)
NAKAI YOSHIHIRO (JP)
NAKAI YOSHIHIRO (JP)
Application Number:
PCT/JP2022/035513
Publication Date:
April 06, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H04R17/00; A61B8/00; C08G59/20; C08K5/18; C08L63/00
Domestic Patent References:
| WO2019088148A1 | 2019-05-09 |
Foreign References:
| JP2013081241A | 2013-05-02 | |||
| JP2009296055A | 2009-12-17 | |||
| JP2011071842A | 2011-04-07 | |||
| JP2021161985A | 2021-10-11 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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