ACOUSTIC MATCHING LAYERED MATERIAL, ACOUSTIC MATCHING SHEET, COMPOSITION FOR ACOUSTIC MATCHING LAYERED MATERIAL, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASUREMENT DEVICE, AND METHOD FOR MANUFACTURING ACOUSTIC WAVE PROBE

Title:

Document Type and Number:

WIPO Patent Application WO/2023/054203

Kind Code:

A1

Abstract:

Provided are an acoustic matching layered material, acoustic matching sheet, composition for acoustic matching layered material, acoustic wave probe, acoustic wave measurement device, and method for manufacturing acoustic wave probe, the acoustic matching layered material containing an epoxy resin (A) component have an epoxy equivalent of 140 or less, and metal particles (B) having a density at 20°C of 10 g/cm3 or more, and the content of particles (C) having a density at 20°C of less than 4.5 g/cm3 being less than 5 mass%.

Inventors:

FURUKAWA KAZUSHI (JP)
NAKAI YOSHIHIRO (JP)

Application Number:

PCT/JP2022/035512

Publication Date:

April 06, 2023

Filing Date:

September 22, 2022

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FUJIFILM CORP (JP)

International Classes:

H04R17/00; A61B8/00; C08G59/20; C08K5/18; C08L63/00

Domestic Patent References:

WO2019088148A1

2019-05-09

Foreign References:

JP2013081241A	2013-05-02
JP2009296055A	2009-12-17
JP2011071842A	2011-04-07
JP2021161984A	2021-10-11

Attorney, Agent or Firm:

IIDA & PARTNERS et al. (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: GAAS WAFER, GAAS WAFER GROUP, AND METHOD FOR PRODUCING GAAS INGOT

Next Patent: ACOUSTIC MATCHING LAYERED MATERIAL, ACOUSTIC MATCHING SHEET, COMPOSITION FOR ACOUSTIC MATCHING LAYER...