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Title:
ACOUSTIC PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/238720
Kind Code:
A1
Abstract:
Provided is an acoustic processing apparatus in which a microelectromechanical systems (MEMS) device is effectively arranged. The acoustic processing apparatus includes an enclosure, a sound duct extending from the enclosure, and a MEMS device housed in the sound duct.

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Inventors:
SUGAWARA SEIYA (JP)
NAGENO KOJI (JP)
Application Number:
PCT/JP2023/019891
Publication Date:
December 14, 2023
Filing Date:
May 29, 2023
Export Citation:
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Assignee:
SONY GROUP CORP (JP)
International Classes:
H04R1/10
Domestic Patent References:
WO2021224497A12021-11-11
Foreign References:
KR101899005B12018-09-14
US20150370527A12015-12-24
US9654860B22017-05-16
US11006197B12021-05-11
Attorney, Agent or Firm:
SUGIURA PATENT OFFICE et al. (JP)
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