ACOUSTIC SENSOR MODULE DESIGN AND FABRICATION PROCESS

Title:

ACOUSTIC SENSOR MODULE DESIGN AND FABRICATION PROCESS

Document Type and Number:

WIPO Patent Application WO2001053820

Kind Code:

A8

Abstract:

The design and method of fabrication for an acoustic sensor module (10) for mounting on the hull of a submarine or surface ship is disclosed. The design involves the use of molded alignment structures (140) to position the acoustic sensors (20) within a two part shell (40) prior to the two part shell (40) being filled with an acoustic medium (30) used to encapsulate the acoustic sensors (20). The disclosed design and fabrication method reduce tooling requirements and eliminate a significant amount of assembly labor in fabricating hull mounted sonar arrays.

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Inventors:

GOLDNER ERIC LEE
SALINAS JOSEPH SCOTT

Application Number:

PCT/US2001/001975

Publication Date:

January 31, 2002

Filing Date:

January 22, 2001

Export Citation:

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Assignee:

LITTON SYSTEMS INC (US)

International Classes:

G10K11/00; (IPC1-7): G01N29/00

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