Title:
ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/054675
Kind Code:
A1
Abstract:
This acoustic wave device comprises a support substrate including a support member and a bonding layer provided on the support member, a piezoelectric layer provided on the bonding layer, and a functional electrode provided on the piezoelectric layer. The support substrate is provided with a cavity portion at a position overlapping with a part of the functional electrode in the stacking direction of the support member, the bonding layer and the piezoelectric layer, and the bonding layer is provided with a void portion.
Inventors:
INOUE KAZUNORI (JP)
Application Number:
PCT/JP2022/036705
Publication Date:
April 06, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/145
Domestic Patent References:
| WO2019220721A1 | 2019-11-21 | |||
| WO2021060521A1 | 2021-04-01 |
Foreign References:
| JP2007208845A | 2007-08-16 | |||
| US20210044277A1 | 2021-02-11 | |||
| JP2010093398A | 2010-04-22 | |||
| JP2022176790A | 2022-11-30 | |||
| JP2014013991A | 2014-01-23 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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