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Patent Searching and Data


Title:
ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/054675
Kind Code:
A1
Abstract:
This acoustic wave device comprises a support substrate including a support member and a bonding layer provided on the support member, a piezoelectric layer provided on the bonding layer, and a functional electrode provided on the piezoelectric layer. The support substrate is provided with a cavity portion at a position overlapping with a part of the functional electrode in the stacking direction of the support member, the bonding layer and the piezoelectric layer, and the bonding layer is provided with a void portion.

Inventors:
INOUE KAZUNORI (JP)
Application Number:
PCT/JP2022/036705
Publication Date:
April 06, 2023
Filing Date:
September 30, 2022
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/145
Domestic Patent References:
WO2019220721A12019-11-21
WO2021060521A12021-04-01
Foreign References:
JP2007208845A2007-08-16
US20210044277A12021-02-11
JP2010093398A2010-04-22
JP2022176790A2022-11-30
JP2014013991A2014-01-23
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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