Title:
CURABLE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/054676
Kind Code:
A1
Abstract:
Provided is a curable adhesive sheet comprising a curable adhesive layer, with which a cured product having a dielectric loss tangent of 0.01 or less at 23 °C and at 1 GHz can be formed, and first and second release films between which both sides of the curable adhesive layer are held, wherein: the first and second release films have a resin film and a release layer that is provided on one surface of the resin film, is formed from non-silicone release agent, and contacts a surface of the curable adhesive layer; and the following requirement (I) is satisfied. Requirement (I): the peel force (R1) at the time when the first release film is peeled from the curable adhesive layer at the peeling angle of 180 ° and at the peel rate of 300 mm/min is not more than 250 mN/50 mm.
Inventors:
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
IZUMI NAOFUMI (JP)
KASHIO MIKIHIRO (JP)
IZUMI NAOFUMI (JP)
Application Number:
PCT/JP2022/036714
Publication Date:
April 06, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J11/08; C09J7/35; C09J7/40; C09J201/00
Domestic Patent References:
| WO2021106847A1 | 2021-06-03 | |||
| WO2010038697A1 | 2010-04-08 |
Foreign References:
| JP2015004009A | 2015-01-08 | |||
| JP2013091785A | 2013-05-16 | |||
| JP2005332516A | 2005-12-02 | |||
| JP2013067743A | 2013-04-18 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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