Title:
ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/114918
Kind Code:
A1
Abstract:
An acoustic wave device provided on a mounting substrate and having an inductor one end of which is connected to a resonator is improved in heat radiation. An acoustic wave device (1) includes a resonator (P2) and an inductor (L). One end of the inductor (L) is connected to the resonator (P2), and the other end of the inductor (L) is connected to a ground electrode or a signal electrode. The acoustic wave device (1) includes a chip (20) and a mounting substrate (30). The chip (20) has a piezoelectric substrate (21) and an IDT electrode (22b). The IDT electrode (22b) is mounted on the piezoelectric substrate (21). The IDT electrode (22b) forms the resonator (P2). The chip (20) is mounted to the mounting substrate (30). The mounting substrate (30) is provided with the inductor (L). On a surface of the mounting substrate (30) on the reverse side from the chip (20), a dummy electrode (35c) connected to the one end of the inductor (L) and the ground electrode or the signal electrode are disposed.
Inventors:
TSUDA MOTOJI (JP)
Application Number:
PCT/JP2013/050170
Publication Date:
August 08, 2013
Filing Date:
January 09, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/64
Domestic Patent References:
| WO2007114390A1 | 2007-10-11 | |||
| WO2008029641A1 | 2008-03-13 |
Foreign References:
| JPH0998046A | 1997-04-08 | |||
| JP2010171680A | 2010-08-05 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Download PDF:
Claims:
Previous Patent: MEMS DEVICE AND ELECTRONIC INSTRUMENT HAVING PROJECTOR FUNCTION
Next Patent: METHOD OF MANUFACTURING ELECTRONIC PART
Next Patent: METHOD OF MANUFACTURING ELECTRONIC PART