Title:
METHOD OF MANUFACTURING ELECTRONIC PART
Document Type and Number:
WIPO Patent Application WO/2013/114919
Kind Code:
A1
Abstract:
Provided is a method of manufacturing an electronic part, wherein an intermediate inspection can be executed during manufacturing processes. In a process wherein a plurality of element electrodes (11) and a feeding line (22) are formed on a mother substrate (21) that is for providing substrates (10), the plurality of element electrodes (11) and the feeding line (22) are formed such that pad sections (11b) of each of the plurality of element electrodes (11) and the feeding line (22) are opposed to each other in planar view with gaps interposed therebetween, and such that the feeding line (22) is positioned lower than the pad sections (11b). A plating film (27) that electrically connects the feeding line (22) and the pad sections (11b) is formed by executing electroplating while feeding electricity to the feeding line (22). Electronic parts (1) are obtained by dividing the mother substrate (21) into individual pieces.
More Like This:
Inventors:
TSUDA MOTOJI (JP)
Application Number:
PCT/JP2013/050171
Publication Date:
August 08, 2013
Filing Date:
January 09, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L41/22; H01L41/09; H01L41/18; H03H3/08; H03H9/25
Domestic Patent References:
| WO2010047031A1 | 2010-04-29 |
Foreign References:
| JP2010103811A | 2010-05-06 | |||
| JP2007028195A | 2007-02-01 | |||
| JP2011229043A | 2011-11-10 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Download PDF:
Claims: