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Patent Searching and Data


Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/017702
Kind Code:
A1
Abstract:
Provided are: an actinic ray-sensitive or radiation-sensitive resin composition that has excellent EL performance and LWR performance and can reduce development defects; an actinic ray-sensitive or radiation-sensitive film using the composition; a pattern formation method; and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition contains: a resin (A), the polarity of which is increased by the action of an acid; and a compound represented by general formula (DA1) set forth in the specification.

Inventors:
YAMAGUCHI SHUHEI (JP)
Application Number:
PCT/JP2022/027517
Publication Date:
February 16, 2023
Filing Date:
July 13, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F212/08; G03F7/039; G03F7/20
Foreign References:
JP2018155908A2018-10-04
JP2021081708A2021-05-27
JP2020098330A2020-06-25
JP2021047396A2021-03-25
CN104985914A2015-10-21
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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