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Title:
ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2020/045534
Kind Code:
A1
Abstract:
The present invention provides: an active-light-sensitive or radiation-sensitive resin composition containing (A) a resin that decomposes due to the action of an acid, the degree of solubility increasing in an alkaline developing solution, and (B) a compound that generates an acid due to irradiation with active light rays or radiation, the compound being represented in a specific structure; an active-light-sensitive or radiation-sensitive film using the composition; a pattern formation method; a method for manufacturing an electronic device; and a compound.

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Inventors:
MIYOSHI TARO (JP)
YONEKUTA YASUNORI (JP)
FUKUZAKI EIJI (JP)
Application Number:
PCT/JP2019/033802
Publication Date:
March 05, 2020
Filing Date:
August 28, 2019
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/039; G03F7/20; C07C309/32; C07C309/42; C07C309/57
Foreign References:
JP2010237654A2010-10-21
JP2015232598A2015-12-24
JP2000344733A2000-12-12
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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