Title:
ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/220189
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an active light-sensitive or radiation-sensitive resin composition which exhibits excellent development defect suppressing performance. The present invention also addresses the problem of providing a resist film, a pattern forming method, and a method for producing an electronic device, each being related to the active light-sensitive or radiation-sensitive resin composition. An active light-sensitive or radiation-sensitive resin composition according to the present invention contains a resin that has a repeating unit A represented by formula (A), while additionally containing a compound that is represented by any one of formulae (1) to (4), wherein: the resin additionally comprises a group, the polarity of which is increased when decomposed by the action of an acid; and/or the resin additionally comprises a repeating unit a which has a residue formed by removing one or two hydrogen atoms from a compound that is represented by any one of formulae (1) to (4), with the content of the repeating unit a being 10% by mole or more relative to all repeating units in the resin.
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Inventors:
MIYOSHI TARO (JP)
YAMAGUCHI SHUHEI (JP)
YOSHIOKA TOMOAKI (JP)
FUKUZAKI EIJI (JP)
YAMAGUCHI SHUHEI (JP)
YOSHIOKA TOMOAKI (JP)
FUKUZAKI EIJI (JP)
Application Number:
PCT/JP2022/017242
Publication Date:
October 20, 2022
Filing Date:
April 07, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F212/14; C08F220/30; G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
| WO2018056369A1 | 2018-03-29 |
Foreign References:
| JP2011186341A | 2011-09-22 | |||
| JP2017107211A | 2017-06-15 | |||
| JP2002236358A | 2002-08-23 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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