Title:
ADHESIVE AGENT COMPOSITION, FILM-FORM ADHESIVE AGENT, DICING/DIE-BONDING INTEGRATED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/149581
Kind Code:
A1
Abstract:
The present disclosure provides an adhesive agent composition. The adhesive agent composition contains an epoxy resin, a first curing agent having a softening point of 90°C or higher, a second curing agent having a softening point of less than 90°C, and an elastomer. The elastomer content is 22-45 mass%, based on the total mass of the adhesive agent composition. The present disclosure also provides a film-form adhesive agent in which such an adhesive agent composition is used, a dicing/die-bonding integrated film, a semiconductor device, and a method for manufacturing the same. Furthermore, the present disclosure provides a method for manufacturing a semiconductor device in which such a dicing/die-bonding integrated film is used.
Inventors:
KUNITO YUI (JP)
NAKAMURA KANAMI (JP)
YAMAMOTO KAZUHIRO (JP)
AOYAGI SHOTA (JP)
NAKAMURA KANAMI (JP)
YAMAMOTO KAZUHIRO (JP)
AOYAGI SHOTA (JP)
Application Number:
PCT/JP2022/000139
Publication Date:
July 14, 2022
Filing Date:
January 05, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J11/04; C09J7/30; C09J11/06; C09J163/00
Foreign References:
| JP2014175459A | 2014-09-22 | |||
| JP2013256574A | 2013-12-26 | |||
| JP2011052109A | 2011-03-17 | |||
| JP2009231469A | 2009-10-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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