Title:
FILM-LIKE ADHESIVE, INTEGRATED DICING/DIE BONDING FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/149582
Kind Code:
A1
Abstract:
The present disclosure provides a film-like adhesive. With respect to this film-like adhesive, the shear viscosity at 120°C is 17000 Pa·s or less, the storage elastic modulus at 150°C is 23 MPa or more after being cured at 170°C for one hour, and the thickness is 30 μm or less. The present disclosure also provides: an integrated dicing/die bonding film which uses this film-like adhesive; a semiconductor device; and a method for producing this semiconductor device. The present disclosure also provides a method for producing a semiconductor device, said method using this integrated dicing/die bonding film.
Inventors:
KUNITO YUI (JP)
NAKAMURA KANAMI (JP)
YAMAMOTO KAZUHIRO (JP)
AOYAGI SHOTA (JP)
NAKAMURA KANAMI (JP)
YAMAMOTO KAZUHIRO (JP)
AOYAGI SHOTA (JP)
Application Number:
PCT/JP2022/000142
Publication Date:
July 14, 2022
Filing Date:
January 05, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J11/04; C09J7/35; C09J11/08; C09J163/00; H01L21/52; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2014175459A | 2014-09-22 | |||
| JP2013256574A | 2013-12-26 | |||
| JP2011052109A | 2011-03-17 | |||
| JP2009231469A | 2009-10-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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