Title:
ADHESIVE AGENT, ADHESIVE TAPE, ELECTRICAL APPLIANCE, ONBOARD MEMBER, AND SECURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/125247
Kind Code:
A1
Abstract:
An adhesive agent containing a polymer (X1) that contains at least 48 mass% of structural units derived from at least one monomer (Y) selected from the group consisting of monomers (A1) represented by general formula (1) and monomers (B1) represented by general formula (2), the adhesive agent being such that tanδ (23°C) derived using the expression G"(23°C)/G'(23°C) is 0.8-1.3, where G'(23°C) is the storage elastic modulus at 23°C, and G"(23°C) is the loss tangent at 23°C. In formula (1), R1 represents H or CH3, R2 represents -CnH2n+1, and n represents an integer of 7-14. In formula (2), R3 represents -C(=O)CmH2m+1, and m represents an integer of 7-13. The present invention thereby improves holding force at high temperatures, affixation properties at low temperatures, and adhesion to low-polarity adherends while raising the biological rate.
Inventors:
KATAOKA HIROYUKI (JP)
YAMAMOTO HIROKI (JP)
ADACHI AYA (JP)
HIDA TOMOHIRO (JP)
YAMAMOTO HIROKI (JP)
ADACHI AYA (JP)
HIDA TOMOHIRO (JP)
Application Number:
PCT/JP2020/047065
Publication Date:
June 24, 2021
Filing Date:
December 16, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B32B27/00; C09J7/21; C09J7/22; C09J7/26; C09J7/38; C09J131/02; C09J133/04; C09J133/08; C09J133/10; C09J201/00
Foreign References:
| JPS5846236B2 | 1983-10-14 | |||
| JP2014152198A | 2014-08-25 | |||
| JP2016000774A | 2016-01-07 | |||
| JP2019047075A | 2019-03-22 | |||
| JP2014531500A | 2014-11-27 | |||
| JP2011088961A | 2011-05-06 | |||
| JP2010037463A | 2010-02-18 | |||
| JP2015209527A | 2015-11-24 |
Other References:
See also references of EP 4079517A4
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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