Title:
HEAT-DISSIPATING RESIN COMPOSITION FOR CHIP RESISTOR PROTECTIVE FILM, CHIP RESISTOR PROTECTIVE FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/125248
Kind Code:
A1
Abstract:
The present invention is a heat-dissipating resin composition for a chip resistor protective film, the composition containing a thermosetting resin, a curing agent, and a heat-dissipating filler having a thermal conductivity of at least 10 W/m·K in an amount of at least 60 volume%, and having a weight loss temperature of a cured product thereof of at least 300 °C. According to the present invention, it is possible to provide: a heat-dissipating resin composition for a chip resistor protective film, from which, even when an electronic component is made for high-power use or is made smaller, a chip resistor protective film capable of suppressing damage to the chip resistor and having excellent durability can be formed; a chip resistor protective film composed of a cured product of said composition; and an electronic component provided with the chip resistor protective film.
Inventors:
NISHIMURA TAKASHI (JP)
WANG WENTAO (JP)
WANG WENTAO (JP)
Application Number:
PCT/JP2020/047066
Publication Date:
June 24, 2021
Filing Date:
December 16, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01C1/02; C08G59/22; C08K3/01; C08L63/00; H01C1/034; H01C1/084; H01C7/00
Domestic Patent References:
| WO2016104136A1 | 2016-06-30 | |||
| WO2019116814A1 | 2019-06-20 |
Foreign References:
| JP2011089072A | 2011-05-06 | |||
| JP2011046928A | 2011-03-10 | |||
| JP2004323777A | 2004-11-18 | |||
| JP2004156024A | 2004-06-03 | |||
| JP2009091424A | 2009-04-30 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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