Title:
ADHESIVE APPLICATION DEVICE AND ADHESIVE APPLICATION METHOD FOR ABSORBENT ARTICLE
Document Type and Number:
WIPO Patent Application WO/2012/039333
Kind Code:
A1
Abstract:
Provided is an adhesive application device which has a discharge part for discharging a thermoplastic adhesive and in which a thermoplastic adhesive is discharged from the discharge part and applied to one surface of a continuous sheet for an absorbent article running on a specific track. The device has a contact and separation mechanism that moves the continuous sheet and the discharge part relatively to the other in the contact or separation direction, a discharge mechanism that discharges the thermoplastic adhesive from the discharge part, and a controller that controls the contact and separation mechanism and the discharge mechanism. When the running speed of the continuous sheet is higher than a specific threshold value, the controller controls the contact and separation mechanism and the discharge mechanism so as to discharge the thermoplastic adhesive from the discharge part while bringing the discharge part into contact with the one surface of the continuous sheet. When the running speed becomes the specific threshold value or lower, the controller controls the contact and separation mechanism and the discharge mechanism so as to stop discharge of the thermoplastic adhesive from the discharge portion and put the continuous sheet and the discharge portion into a state of separation after discharge has been stopped.
Inventors:
SAKAUE HARUHIKO (JP)
Application Number:
PCT/JP2011/070976
Publication Date:
March 29, 2012
Filing Date:
September 14, 2011
Export Citation:
Assignee:
UNI CHARM CORP (JP)
SAKAUE HARUHIKO (JP)
SAKAUE HARUHIKO (JP)
International Classes:
A61F13/15; A61F13/49; B05C5/04; B05C11/10; B05D3/00; B05D7/24
Foreign References:
| JPS63296865A | 1988-12-02 | |||
| JPH05111658A | 1993-05-07 | |||
| JP2000084457A | 2000-03-28 |
Other References:
See also references of EP 2620131A4
Attorney, Agent or Firm:
ISSHIKI & CO. (JP)
All international patent business corporation (JP)
All international patent business corporation (JP)
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Claims: