Title:
BYPASS DIODE DEVICE, METHOD FOR INSPECTING SAME, AND METHOD FOR MANUFACTURING FILM DIODE DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/039332
Kind Code:
A1
Abstract:
[Problem] In conventional bypass diode devices, there have been problems in that workability is poor because diodes were installed individually for each cell in a photovoltaic device, and shortening hours worked was difficult.
[Solution] In this bypass diode device (1) a plurality of diodes (5a - 5i) is formed on the upper surface of a supporting substrate (2) and connected in series. Furthermore, a plurality of terminal connection parts (4) that connect to the diodes (5a - 5i) is disposed so as to correspond with electrodes for external connections for each cell of a photovoltaic device. With this structure, the plurality of diodes (5a - 5i) is connected to the various cells of the photovoltaic device in a single installation operation, the workability for that installation improved, and shortening of the time for installation achieved.
Inventors:
YAGIHASHI YUJI (JP)
SATOH MICHIO (JP)
SATOH MICHIO (JP)
Application Number:
PCT/JP2011/070966
Publication Date:
March 29, 2012
Filing Date:
September 14, 2011
Export Citation:
Assignee:
SANYO ELECTRIC CO (JP)
SANYO AMORUTON CO LTD (JP)
YAGIHASHI YUJI (JP)
SATOH MICHIO (JP)
SANYO AMORUTON CO LTD (JP)
YAGIHASHI YUJI (JP)
SATOH MICHIO (JP)
International Classes:
H01L31/042
Foreign References:
| JP2010080916A | 2010-04-08 | |||
| JP2009533856A | 2009-09-17 | |||
| JP2009044049A | 2009-02-26 |
Attorney, Agent or Firm:
Hiroshi Sumiya (JP)
KADOYA HIROSHI (JP)
KADOYA HIROSHI (JP)
Download PDF:
Claims: