Title:
ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/187625
Kind Code:
A1
Abstract:
The present invention relates to an adhesive-attached metal substrate and a laminate that have a low-dielectric property in a high-frequency region, and in which sufficient adhesive strength can be ensured between a resin film and a metal layer. More specifically, the present invention relates to an adhesive-attached metal substrate and a laminate comprising the adhesive-attached metal substrate, the adhesive-attached metal substrate comprising a metal layer and an adhesive resin layer formed of an adhesive resin. The adhesive resin includes a polyimid resin (A), a maleimide compound (B), and a radical initiator. The mass ratio of the polyimid resin (A) to the maleimide compound (B) is 10:1 to 3:2. The content of the radical initiator is more than or equal to 1 part by mass and less than 15 parts by mass based on 100 parts by mass of the maleimide compound (B). The thickness of the adhesive resin layer is 1-5 μm.
Inventors:
NOMURA TADAHIRO (JP)
SAKURAGI TAKANORI (JP)
TAKEI KUNIHIRO (JP)
SAKURAGI TAKANORI (JP)
TAKEI KUNIHIRO (JP)
Application Number:
PCT/IB2023/053048
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
B32B15/088; H05K1/03
Domestic Patent References:
| WO2022004583A1 | 2022-01-06 | |||
| WO2020189354A1 | 2020-09-24 |
Foreign References:
| JP2018041961A | 2018-03-15 | |||
| JP2017121807A | 2017-07-13 | |||
| JP2021161130A | 2021-10-11 |
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