Title:
ADHESIVE-EQUIPPED METAL SUBSTRATE AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/187624
Kind Code:
A1
Abstract:
The present invention relates to an adhesive-equipped metal substrate and a laminate that have low dielectric characteristics in a high-frequency range and can adequately ensure the strength of adhesion between a resin film and a metal layer. More specifically, the present invention relates to an adhesive-equipped metal substrate comprising a metal layer and an adhesive resin layer formed from an adhesive resin composition, wherein: the adhesive resin composition includes a polyimide resin (A), a maleimide compound (B), a radical initiator, and an epoxy resin; the mass ratio of the polyimide resin (A) and the maleimide compound (B) is in the range from 10:1 to 3:2; the radical initiator content, relative to 100 parts by mass of the maleimide compound (B), is at least 1 part by mass and less than 15 parts by mass; and the epoxy resin content, relative to a total of 100 parts by mass of the polyimide resin (A) and the maleimide compound (B), is at least 1 part by mass and no more than 5 parts by mass. This invention also relates to a laminate comprising said adhesive-equipped metal substrate.
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Inventors:
NOMURA TADAHIRO (JP)
SAKURAGI TAKANORI (JP)
TAKEI KUNIHIRO (JP)
SAKURAGI TAKANORI (JP)
TAKEI KUNIHIRO (JP)
Application Number:
PCT/IB2023/053046
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
B32B15/088; H05K1/03
Domestic Patent References:
| WO2022004583A1 | 2022-01-06 | |||
| WO2020189354A1 | 2020-09-24 |
Foreign References:
| JP2018041961A | 2018-03-15 | |||
| JP2017121807A | 2017-07-13 | |||
| JP2021161130A | 2021-10-11 | |||
| JP2023039241A | 2023-03-20 |
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