Title:
ADHESIVE COMPOSITION, AND BONDING SHEET, MULTILAYER BODY AND PRINTED WIRING BOARD EACH CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2022/196586
Kind Code:
A1
Abstract:
[Problem] To provide: an adhesive composition which has excellent heat resistance, excellent adhesive strength, low relative dielectric constant, low dielectric loss tangent and excellent dielectric characteristics; and a bonding sheet, a multilayer body and a printed wiring board, each of which comprises this adhesive composition. [Solution] An adhesive composition which contains an acid-modified resin, a compound A and a compound B. Compound A: a compound which has a terminal unsaturated hydrocarbon group, while having a 5% weight loss temperature of 260°C or more
Compound B: a compound which has an epoxy group and a terminal unsaturated hydrocarbon group
Inventors:
SAKAMOTO KOICHI (JP)
KAWAKUSU TETSUO (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2022/011090
Publication Date:
September 22, 2022
Filing Date:
March 11, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B27/32; C09J4/06; C09J7/30; C09J11/06; C09J123/26; C09J123/30; C09J161/10; C09J171/12
Domestic Patent References:
| WO2011125778A1 | 2011-10-13 | |||
| WO2020080391A1 | 2020-04-23 |
Foreign References:
| JP2011011458A | 2011-01-20 | |||
| JP2017047686A | 2017-03-09 | |||
| JP2017161837A | 2017-09-14 |
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