Title:
ADHESIVE COMPOSITION, AND ADHESIVE SHEET, LAMINATE AND PRINTED CIRCUIT BOARD CONTAINING THIS
Document Type and Number:
WIPO Patent Application WO/2022/196585
Kind Code:
A1
Abstract:
[Problem] To provide an adhesive composition with excellent heat resistance and adhesion strength, with low relative permittivity and dielectric loss tangent, and with excellent dielectric properties, and to provide an adhesive sheet, a laminate and a printed circuit board containing said adhesive composition. [Solution] This adhesive composition contains a polyester resin, a compound A and a compound B. Compound A: a compound that has a terminal unsaturated hydrocarbon group and that has a 5% weight reduction temperature of at least 260°C. Compound B: a compound that has an epoxy group and a terminal unsaturated hydrocarbon group.
Inventors:
SAKAMOTO KOICHI (JP)
KAWAKUSU TETSUO (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2022/011089
Publication Date:
September 22, 2022
Filing Date:
March 11, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B27/36; C09J4/06; C09J7/30; C09J161/10; C09J167/00; C09J171/12
Domestic Patent References:
| WO2011125778A1 | 2011-10-13 | |||
| WO2020080391A1 | 2020-04-23 |
Foreign References:
| JP2011011458A | 2011-01-20 | |||
| JP2017047686A | 2017-03-09 | |||
| JP2017161837A | 2017-09-14 |
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