Title:
ADHESIVE COMPOSITION AND ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2012/164836
Kind Code:
A1
Abstract:
Provided is an adhesive composition which is free from halogens and has improved adhesiveness and improved long-term reliability compared with the conventional adhesive compositions. The adhesive composition comprises, per 100 parts by weight of a polyether-ester amide, 1-100 parts by weight of a crystalline polyester and 20-110 parts by weight of silica. A conductive paste can be prepared by adding conductive particles to the aforesaid adhesive composition.
Inventors:
KINOSHITA JUNICHI (JP)
TERADA TSUNEHIKO (JP)
TERADA TSUNEHIKO (JP)
Application Number:
PCT/JP2012/003066
Publication Date:
December 06, 2012
Filing Date:
May 10, 2012
Export Citation:
Assignee:
TATSUTA DENSEN KK (JP)
KINOSHITA JUNICHI (JP)
TERADA TSUNEHIKO (JP)
KINOSHITA JUNICHI (JP)
TERADA TSUNEHIKO (JP)
International Classes:
C09J177/12; C09J7/10; C09J9/02; C09J11/04; C09J167/00
Foreign References:
| JP2001354938A | 2001-12-25 | |||
| JP2006152233A | 2006-06-15 | |||
| JP2002138269A | 2002-05-14 | |||
| JP2010168510A | 2010-08-05 |
Attorney, Agent or Firm:
TSUTADA, Akiko et al. (JP)
Shoko Tsutada (JP)
Shoko Tsutada (JP)
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Claims:
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