Title:
ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED WIRING BOARD, ADHESIVE FOR FLEXIBLE PRINTED WIRING BOARD, AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/079670
Kind Code:
A1
Abstract:
As an adhesive composition which exhibits excellent long term durability in moist heat environments and excellent adhesive properties, the present invention provides an adhesive composition for a flexible printed wiring board, which contains a polyester-based resin (A1) containing structural units derived from a polycarboxylic acid and structural units derived from a polyhydric alcohol, and which is characterized in that the polyester-based resin (A1) satisfies the requirements. [1] The ester bond concentration is 7 mmol/g or less. [2] The acid value is 3 mg KOH/g or more. [3] The glass transition temperature (Tg) is -5ºC or higher.
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Inventors:
NAKANE TAKAYUKI (JP)
Application Number:
PCT/JP2020/035562
Publication Date:
April 29, 2021
Filing Date:
September 18, 2020
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C09J163/00; C09J167/00; C09J167/02; H05K1/03
Domestic Patent References:
| WO2016001949A1 | 2016-01-07 |
Foreign References:
| JP2016222748A | 2016-12-28 | |||
| JP2017031301A | 2017-02-09 | |||
| JP2015134906A | 2015-07-27 |
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
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