Title:
ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/187518
Kind Code:
A1
Abstract:
An adhesive composition which contains silver particles containing silver atoms and zinc particles containing zinc metal. Relative to the total amount of the transition metal atoms in the solid content of this adhesive composition, the content of silver atoms is 90% by mass or more and the content of zinc atoms is from 0.01% by mass to 0.6% by mass (inclusive).
Inventors:
NAKAKO HIDEO (JP)
TANAKA TOSHIAKI (JP)
NATORI MICHIKO (JP)
ISHIKAWA DAI (JP)
MATSUMOTO HIROSHI (JP)
TANAKA TOSHIAKI (JP)
NATORI MICHIKO (JP)
ISHIKAWA DAI (JP)
MATSUMOTO HIROSHI (JP)
Application Number:
PCT/JP2013/066516
Publication Date:
December 19, 2013
Filing Date:
June 14, 2013
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J1/00; H01B1/00; H01B1/22; H01L21/52
Domestic Patent References:
| WO2013094543A1 | 2013-06-27 |
Foreign References:
| JP2002150838A | 2002-05-24 | |||
| JPH0581923A | 1993-04-02 | |||
| JPH06329960A | 1994-11-29 | |||
| JPH06336562A | 1994-12-06 | |||
| JP2012067155A | 2012-04-05 | |||
| JP2004111253A | 2004-04-08 | |||
| JP2004111254A | 2004-04-08 | |||
| JP2006073811A | 2006-03-16 | |||
| JP2006302834A | 2006-11-02 | |||
| JPH1166953A | 1999-03-09 | |||
| JP2005093996A | 2005-04-07 | |||
| JP2006083377A | 2006-03-30 | |||
| JP4353380B2 | 2009-10-28 |
Other References:
"rheology no sokutei to control ichimon ittou shu - rheology wo hakatte maruhadaka ni suru", 2010, TECHNICAL INFORMATION INSTITUTE CO., LTD., pages: 39 - 46
See also references of EP 2862910A4
See also references of EP 2862910A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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