Title:
ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, AN ADHESIVE FILM COMPRISING THE SAME AND A SEMICONDUCTOR PACKAGE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2012/081771
Kind Code:
A1
Abstract:
Provided is a high-fluidity adhesive composition for a semiconductor, wherein the composition: contains a flux-action curing agent having a specific structure; allows a flux process which satisfies the requirement for reliability of bump-chip electrical connection and removes any oxide film on the solder and a Cu bump as a bump-chip contact layer; and ensures adequate mutual contact between the solder and bump during chip bonding by thermocompression bonding. Also provided are an adhesive film comprising the composition and a semiconductor package using the composition.
Inventors:
PYUN AH RAM (KR)
UH DONG SEON (KR)
SONG KI TAE (KR)
CHO JAE HYUN (KR)
KIM IN HWAN (KR)
UH DONG SEON (KR)
SONG KI TAE (KR)
CHO JAE HYUN (KR)
KIM IN HWAN (KR)
Application Number:
PCT/KR2011/002069
Publication Date:
June 21, 2012
Filing Date:
March 25, 2011
Export Citation:
Assignee:
CHEIL IND INC (KR)
PYUN AH RAM (KR)
UH DONG SEON (KR)
SONG KI TAE (KR)
CHO JAE HYUN (KR)
KIM IN HWAN (KR)
PYUN AH RAM (KR)
UH DONG SEON (KR)
SONG KI TAE (KR)
CHO JAE HYUN (KR)
KIM IN HWAN (KR)
International Classes:
C09J11/06; C09J7/10; C09J163/00; H01L21/58
Foreign References:
| KR20100105756A | 2010-09-29 | |||
| KR20080059386A | 2008-06-27 | |||
| EP2079108A1 | 2009-07-15 | |||
| KR20080109895A | 2008-12-17 |
Attorney, Agent or Firm:
AJU KIM CHANG & LEE (KR)
특허법인아주양헌 (KR)
특허법인아주양헌 (KR)
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Claims: