Title:
ADHESIVE COMPOSITION, AND ADHESIVE SHEET USING SAID ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/054085
Kind Code:
A1
Abstract:
The present invention provides an adhesive composition which has excellent adhesive strength when attached to an adherend and excellent peelability when subjected to batch heating at a high temperature, whereby both high initial adhesive strength and low adhesive strength after heating are achieved. An adhesive composition according to the present invention contains a material having a radically polymerizable functional group and a thermal polymerization initiator that generates radicals, wherein the content of the thermal polymerization initiator is 1.2-10 parts by mass with respect to 100 parts by mass of all the components, excluding the thermal polymerization initiator.
Inventors:
HONDA SATOSHI (JP)
TAKEDA YUSUKE (JP)
KUMAKURA KENTA (JP)
KOSAKA NAOFUMI (JP)
TAKAHASHI TOMOKAZU (JP)
TAKEDA YUSUKE (JP)
KUMAKURA KENTA (JP)
KOSAKA NAOFUMI (JP)
TAKAHASHI TOMOKAZU (JP)
Application Number:
PCT/JP2022/035085
Publication Date:
April 06, 2023
Filing Date:
September 21, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08F290/12; C08F2/44; C08F299/00; C09J4/00; C09J5/06; C09J7/38; C09J11/06; C09J133/00; C09J201/02
Foreign References:
| JP2021091892A | 2021-06-17 | |||
| JP2021095526A | 2021-06-24 | |||
| JP2009251177A | 2009-10-29 | |||
| JP2009161620A | 2009-07-23 | |||
| JPH10121004A | 1998-05-12 | |||
| JP2007045955A | 2007-02-22 | |||
| JP2001066430A | 2001-03-16 | |||
| JP2021095450A | 2021-06-24 | |||
| CN109517543A | 2019-03-26 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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