Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET INCLUDING SAID PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/054086
Kind Code:
A1
Abstract:
The present invention provides a pressure-sensitive adhesive composition combining adhesive force with light-releasing properties so that the pressure-sensitive adhesive composition has excellent adhesive force in application to adherends even at high temperatures and, after brought into contact with warm water for removal, can be removed with low peel force without leaving any adhesive residue. This pressure-sensitive adhesive composition comprises: an acrylic polymer comprising a structural unit of a (meth)acrylate monomer containing an alkoxy group, as a main component, and a structural unit of a polymerizable monomer, the homopolymer of which has a Tg of 0°C or higher, the amount of the latter structural unit being 1-40 parts by mass per 100 parts by mass of all the structural monomer units; and a surfactant.
Inventors:
TAKEDA YUSUKE (JP)
HONDA SATOSHI (JP)
KUMAKURA KENTA (JP)
KOSAKA NAOFUMI (JP)
HONDA SATOSHI (JP)
KUMAKURA KENTA (JP)
KOSAKA NAOFUMI (JP)
Application Number:
PCT/JP2022/035086
Publication Date:
April 06, 2023
Filing Date:
September 21, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/06; C09J7/38; C09J11/06; C09J133/14
Foreign References:
| JPH11335655A | 1999-12-07 | |||
| JPH07178035A | 1995-07-18 | |||
| JP2005200540A | 2005-07-28 | |||
| JPH0987597A | 1997-03-31 | |||
| JPH11140407A | 1999-05-25 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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