ADHESIVE COMPOSITION, ADHESIVE, AND ADHESIVE TAPE

Title:

ADHESIVE COMPOSITION, ADHESIVE, AND ADHESIVE TAPE

Document Type and Number:

WIPO Patent Application WO/2020/189652

Kind Code:

A1

Abstract:

Provided is an adhesive composition described below that is capable of securely bonding to a difficult-to-bond adherend such as ethylene propylene diene rubber (EPDM), butyl rubber (IIR), chloroprene rubber (CR), styrene butadiene rubber (SBR), thermoplastic polyolefin rubber, and modified asphalt, and of stably maintaining a high bonding strength when exposed to high temperatures and high humidity.　The adhesive composition is characterized by comprising: an acrylic resin (A) which has an end carboxy group-containing monomer (a1) unit represented by general formula (1), a (meth)acrylic acid monomer (a2) unit, and a hydroxyl group-containing monomer (a3) unit; an epoxy-based crosslinking agent (b1); and an isocyanate-based crosslinking agent (b2). R1 is hydrogen or a methyl group, R2 is a divalent saturated aliphatic group, an unsaturated aliphatic group, an aromatic group, a saturated alicyclic group, or an unsaturated alicyclic hydrocarbon group, and n is an integer of 1 or more.

Inventors:

ISHIKAWA YUTA (JP)

Application Number:

PCT/JP2020/011580

Publication Date:

September 24, 2020

Filing Date:

March 17, 2020

Export Citation:

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Assignee:

MITSUBISHI CHEM CORP (JP)

International Classes:

C09J11/06; C09J7/38; C09J133/00

Domestic Patent References:

WO2018168678A1	2018-09-20
WO2018117262A1	2018-06-28

Foreign References:

JP2019031586A	2019-02-28
JP2014196446A	2014-10-16
JP2013136665A	2013-07-11
JP2006282687A	2006-10-19
JPH02196879A	1990-08-03
JP2008127431A	2008-06-05
JP2014040500A	2014-03-06

Other References: